Instead of connecting the switch chip to pluggable optical modules through electrical traces on a printed circuit board (PCB), CPO brings the optics directly adjacent to the chip. Key benefits: However, these benefits come at the cost of extreme PCB and substrate requirements. PCB Substrate Requirements in COB Architectures COB-based optical modules already demand high-performance. In today's conventional packaging, chips and optical modules are packaged separately and then interconnected externally, which belongs to traditional integrated circuit design. Evolution of. This document provides guidance on the requirements for co-packaged optic assemblies designed for high-radix, network switch applications with 100Gb/s electrical interfaces. However, it's worth noting that Andy Bechtolsheim, co-founder of Arista and a long-standing visionary in data centre. Co-Packaged Optics (CPO) is an optical interconnect architecture that integrates optical engines directly alongside a switch ASIC or compute chip within the same package or substrate. By leveraging advanced packaging technologies such as 2.
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